• SEM sample preparation system
  • Integrated system of Tape mounting, Die sawing, Film expanding, Plishing system


Operation items SEM sample preparation system
Dicing X-Axis Material size 50 x 50mm
Cutting range 40mm
Cutting speed Full Stroke
Y & θ-Axis Full Stroke 250mm/sec
Index Speed Range 0 ~ 300r/min
Resolution Setting: 1000P/R 0.036˚/Pulse
Min.Step 0.1㎛
Z-Axis Max. stroke 75mm
Min.Step 0.1㎛
SPINDLE Speed range to 40,000rpm
Power range 2.4kw
Expanding Wafer Frame Size 100 x 100mm
UV Tape Size 100 x 100mm
EXP. Stoke to 20mm
Polishing Diamond Lapping Film Size 5 inch
Substrates Glass
Polishing Position 4 Place
Control PC I7 Quad Core, 8G Byte Memory , Window 7 64bit
Power AC220V, 50/60Hz 20A, 4.4kW, 3 Phase
Dimension W1700 x D1300 x H1900mm (main)
W400 x D600 x H1000mm(tape mounter)
W340 x D460 x H540 (chiller)
Weight App. 2000kg


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