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FEATURES
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SPECIFICATION
| System name | RF Module Test System |
| Function | RF test |
| Tray Type | JEDEC Standard |
| Target device | BGA, CSP, TSOP,TQFP, E.T.C |
| Package Size | 3mm x 3mm ~ 25mm x 25mm |
| Parallelism | Up to 4devices |
| Loading/unloading method | Automatic P&P, 16 Pickers |
| Loading/unloading tray | 40 trays per 1 stack |
| Tray stacker | 2 loading, 1 empty, 2 good module, 2 bad module |
| Control PC | I7 Quad Core, 8G Byte Memory , Window 7 64bit |
| Air Supply | 5~6 ㎏/㎠ |
| Power | AC220V, 50/60Hz , 30A, 1 Phase |
| Dimension | W2130 x D1834 x H1900(mm) |
| Weight | 1000kg |
