TSE1540

FEATURES

  • RF Module Test System
  • Target device - BGA, CSP, TSOP,TQFP, E.T.C
  • Parallelism - Up to 8 devices
  • Loading/unloading method - Automatic P&P, 16 Pickers

SPECIFICATION

System name RF Module Test System
Function RF test
Tray Type JEDEC Standard
Target device BGA, CSP, TSOP,TQFP, E.T.C
Package Size 3mm x 3mm ~ 25mm x 25mm
Parallelism Up to 4devices
Loading/unloading method Automatic P&P, 16 Pickers
Loading/unloading tray 40 trays per 1 stack
Tray stacker 2 loading, 1 empty, 2 good module, 2 bad module
Control PC I7 Quad Core, 8G Byte Memory , Window 7 64bit
Air Supply 5~6 ㎏/㎠
Power AC220V, 50/60Hz , 30A, 1 Phase
Dimension W2130 x D1834 x H1900(mm)
Weight 1000kg
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