TSE1013 | Auto Laser Marking System - Wafer
- Auto Laser Marking System - Wafer
- Function : Laser marking & sorting
- Target device : Wafer (2”, 4”, 6”, 8”)
- Wafer thickness : 1.5~ 5t
TSE2033 | Auto Laser Marking System - PCB Type Substrate
- Auto Laser Marking System - PCB Type Substrate
- Function : Laser marking
- Target device : PCB Type Substrate
- One-shot coverage : J120x120x42mm (the minimum letter size – 0.1mm)
TSE3013 | RF Laser Marking System - JEDEC tray
- Laser Marking System
- Target device : RF module
- Marking area : JEDEC tray
- One-shot coverage : 330x330x42mm
TSE1026 | Wafer Probe System
- Wafer Probe System
- Function : Wafer Chip Test
- Target device : Wafer (4”, 6”)/li>
- Cassette : 25Wafer / Full Cassette
