TSE1026

FEATURES

  • Wafer Probe System
  • Function : Wafer Chip Test
  • Target device : Wafer (4”, 6”)/li>
  • Cassette : 25Wafer / Full Cassette

SPECIFICATION

System name Wafer Probe System
Function Wafer Chip Test
Target device Wafer (4”, 6”)
Cassette 25Wafer / Full Cassette
Vision Mapping (Top / Bottom) , Realtime View& Scope
Master Class Calibration (Detachable)
Barcode scanner 2D barcode
Tray L/UL capacity Dual Magazine
Wafer L/UL Method Scara (Coro Robot) , Pre Aligner
Control PC I7 Quad Core, 16G Byte Memory, Window 7, 64bit
Air Supply 5~7 ㎏/㎠
Power AC220V, 50/60Hz 20A, 4 kW, 3 Phase
Dimension W1270 x D1110 x H1700(mm)
Weight 2000kg
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