TSE1026
FEATURES
- Wafer Probe System
- Function : Wafer Chip Test
- Target device : Wafer (4”, 6”)/li>
- Cassette : 25Wafer / Full Cassette
SPECIFICATION
System name | Wafer Probe System |
Function | Wafer Chip Test |
Target device | Wafer (4”, 6”) |
Cassette | 25Wafer / Full Cassette |
Vision | Mapping (Top / Bottom) , Realtime View& Scope Master Class Calibration (Detachable) |
Barcode scanner | 2D barcode |
Tray L/UL capacity | Dual Magazine |
Wafer L/UL Method | Scara (Coro Robot) , Pre Aligner |
Control PC | I7 Quad Core, 16G Byte Memory, Window 7, 64bit |
Air Supply | 5~7 ㎏/㎠ |
Power | AC220V, 50/60Hz 20A, 4 kW, 3 Phase |
Dimension | W1270 x D1110 x H1700(mm) |
Weight | 2000kg |