TSE1013
FEATURES
- Auto Laser Marking System - Wafer
- Function : Laser marking & sorting
- Target device : Wafer (2”, 4”, 6”, 8”)
- Wafer thickness : 1.5~ 5t
SPECIFICATION
| System name | Auto Laser Marking System – Wafer |
| Function | Laser marking & sorting |
| Target device | Wafer (2”, 4”, 6”, 8”) |
| Wafer thickness | 1.5 ~ 5t |
| Loading/unloading method | Automatic single arm robot |
| Sheet, Cassette | 25 sheets/a cassette, 6 cassettes |
| Vision | 1 vision SXGA Mono color[RED & White lamp] Edge detection, Alignment |
| Laser source | TBD |
| Barcode scanner | 2D barcode |
| Module loading | Automatic P&P, 2 heads(1picker per head) |
| Control PC | I7 Quad Core, 8G Byte Memory, Window 7, 64bit |
| Air Supply | 5~7kg/㎠ |
| Power | AC220V, 50/60Hz 10A, 2.2kW, 1 Phase |
| Dimension | W1100 x D1140 x H1750(mm) |
| Weight | 720kg |
