TSE1013

FEATURES

  • Auto Laser Marking System - Wafer
  • Function : Laser marking & sorting
  • Target device : Wafer (2”, 4”, 6”, 8”)
  • Wafer thickness : 1.5~ 5t

SPECIFICATION

System name Auto Laser Marking System – Wafer
Function Laser marking & sorting
Target device Wafer (2”, 4”, 6”, 8”)
Wafer thickness 1.5 ~ 5t
Loading/unloading method Automatic single arm robot
Sheet, Cassette 25 sheets/a cassette, 6 cassettes
Vision 1 vision SXGA Mono color[RED & White lamp] Edge detection, Alignment
Laser source TBD
Barcode scanner 2D barcode
Module loading Automatic P&P, 2 heads(1picker per head)
Control PC I7 Quad Core, 8G Byte Memory, Window 7, 64bit
Air Supply 5~7kg/㎠
Power AC220V, 50/60Hz 10A, 2.2kW, 1 Phase
Dimension W1100 x D1140 x H1750(mm)
Weight 720kg
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