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All 4 /반도체 장비 4
TSE1013 | Auto Laser Marking System - Wafer
  • Auto Laser Marking System - Wafer
  • Function : Laser marking & sorting
  • Target device : Wafer (2”, 4”, 6”, 8”)
  • Wafer thickness : 1.5~ 5t
TSE2033 | Auto Laser Marking System - PCB Type Substrate
  • Auto Laser Marking System - PCB Type Substrate
  • Function : Laser marking
  • Target device : PCB Type Substrate
  • One-shot coverage : J120x120x42mm (the minimum letter size – 0.1mm)
TSE3013 | RF Laser Marking System - JEDEC tray
  • Laser Marking System
  • Target device : RF module
  • Marking area : JEDEC tray
  • One-shot coverage : 330x330x42mm
TSE1026 | Wafer Probe System
  • Wafer Probe System
  • Function : Wafer Chip Test
  • Target device : Wafer (4”, 6”)/li>
  • Cassette : 25Wafer / Full Cassette
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