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All 4 /반도체 장비 4
TSE1540 | RF Module Test System
  • RF Module Test System
  • Target device - BGA, CSP, TSOP,TQFP, E.T.C
  • Parallelism - Up to 8 devices
  • Loading/unloading method - Automatic P&P, 16 Pickers
TSE1036 | Film auto expander
  • Film Auto Expander
  • Film expanding, barcode labelling
  • Target device - Ring frame attached wafer (2”, 4”, 6”, 8”)
  • Loading/unloading method - 2 Magazines/ Automatic gripper
TSE1037 | PR Stripper System
  • PR Stripper System
  • Operation items - PR Stripping, Cleaning, Drying
  • Target wafer - Ring frame attached wafer (2”, 4”, 6”, 8”)
  • Loading/unloading method - 2 Magazines/ Automatic gripper
TSE2025 | Automatic Reel In-Line Packing System
  • Automatic Reel In-Line Packing System
  • Function : Packing
  • Target device : Reel module
  • Module L/UL method : JIn-Line (Conveyor)/li>
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