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Wafer Series
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Auto Visual Inspection



Auto Visual Inspection
Auto Visual Inspection
Auto Visual Inspection
Specification
System name | Auto Visual Inspection System |
---|---|
Function | Visual Inspection |
Target device | microSD , microUDP , USB |
Tray L/UL capacity | Max 40trays/empty, full tray stacker |
Jedec tray L/UL method | Manual |
Vision | Top 2ea, FOV 122mm * 93mm / resolution 30um |
Air Supply | 5~7 kg/㎠ |
Dimension | W 2,800 x D 2,000 x H 2,400(mm) |
Weight | 4,000kg |
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