DI Cleaner
VideoFeatures
- Configured with a single port for loading/unloading
- Supports mixed use of 4″, 6″, and 8″ wafers
- Accommodates various wafer sizes with a stepped Spin Chuck Guide
Specification
| Item | Description |
|---|---|
| Function | Wafer Clean |
| Target Device | Wafer (supports mixed use of 4″, 6″, and 8″; COK required) in Ring Frame |
| Spin RPM | Max. 3,000 |
| Chuck | Vacuum Type |
| Dimension | W 1,050 x D 850 x H 1,700 (mm) |
| Weight | 750 kg |
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Wafer Prober
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Wafer Plasma
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Re Ring Auto Handler
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Ring Detach Auto Handler
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Die Tester
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SIP 실장 검사기
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UDP
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