Die Detach Auto Handler
VideoFeatures
- Die Detach MC
Specification
| Item | Description |
|---|---|
| Function | Pick & Place Die on Wafer |
| Cassette | 3 x 10 slot |
| Stage | 2 Stage |
| Die Maping Method | Camera Vision |
| Air Supply | 5~7 kg/㎠ |
| Dimension | W 2,900 x D 2,350 x H 2,000 (mm) |
| Weight | 3,500kg |
Semiconductor Products
PR Coater
Wafer Series
PR Striper
Wafer Series
DI Cleaner
Wafer Series
Wafer Cosmetic Inspector
Wafer Series
Wafer Marker & Sorter
Wafer Series
Wafer Sorter
Wafer Series
Wafer Prober
Wafer Series
Wafer Plasma
Wafer Series
Re Ring Auto Handler
Die Series
Ring Detach Auto Handler
Die Series
Die Tester
Die Series
SIP 실장 검사기
Package
Auto Visual Inspection
Package
UDP
Package
Package Laser Marker
Package