PR Striper
Features
- Supports mixed use of 4″, 6″, and 8″ wafers
- Wafer loading and unloading on the ring frame
- Removes PR from the wafer surface using high-speed spindle motion
- Performs cleaning & drying using DI water, IPA, and N2
Specification
| Item | Description |
|---|---|
| Function | PR Stripping, Cleaning, Drying |
| Target Device | 4”,6”,8” Wafer on Ring Frame(COK required) |
| Spin RPM | Max. 3,000 |
| Chuck | Vac. Type |
| Dimension | W 1,035 x D 1,635 x H 1,850 (mm) |
| Weight | 1,000kg |
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