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Semiconductor
Wafer Series
Die Series
Re Ring Auto Handler





Re Ring Auto Handler
Re Ring Auto Handler
Re Ring Auto Handler
Re Ring Auto Handler
Re Ring Auto Handler
Features
- Wafer/Ring-Frame bonding
Specification
Item | Description |
---|---|
Function | Re-Ring Auto Handler |
Lo/Unloading | Loading: 100 pcs each Unloading: 100 pcs |
Stage | 2 Stages |
Wafer Align Method | Camera Vision |
Air Supply | 5–7 kg/㎠ |
Dimension | W 1,964 x D 2,020 x H 2,320 (mm) |
Weight | 1,500 kg |
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