TIS Co., Ltd.

Re Ring Auto Handler

Products

Re Ring Auto Handler

Re Ring Auto Handler
Re Ring Auto Handler
Re Ring Auto Handler
Re Ring Auto Handler
Re Ring Auto Handler
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VideoWatch Video
Features
  • Wafer/Ring-Frame bonding
Specification
ItemDescription
FunctionRe-Ring Auto Handler
Lo/UnloadingLoading: 100 pcs each
Unloading: 100 pcs
Stage2 Stages
Wafer Align MethodCamera Vision
Air Supply5–7 kg/㎠
DimensionW 1,964 x D 2,020 x H 2,320 (mm)
Weight1,500 kg
Semiconductor Products
Wafer Marker & Sorter
Wafer Marker & Sorter
Wafer Marker & Sorter
Wafer Marker & Sorter
Wafer Marker & Sorter
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