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Semiconductor
Wafer Series
Die Series
Ring Detach Auto Handler



Ring Detach Auto Handler
Ring Detach Auto Handler
Ring Detach Auto Handler
Features
- Separate the ring frame from the wafer and insert a spacer
Specification
Item | Description |
---|---|
Function | Ring Detach Auto Handler |
Target Device | Wafer Ring / Spacer |
L/UL method | Manual |
Air Supply | 5~7 kg/㎠ |
Dimension |
W 2,000 x D 850 x H 1,700 (mm) W 2,000 x D 1,500 x H 1,700 (mm) ※ With optional features |
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