Wafer Cosmetic Inspector
Features
- Configured with a single port for loading/unloading
- Supports mixed use of 4″, 6″, and 8″ wafers
- Performs simultaneous wafer edge chipping inspection with upper and lower optical (vision) systems
Specification
| Item | Description |
|---|---|
| Target Device | Wafer (supports mixed use of 4″, 6″, and 8″; COK required) |
| Cassette | 3 ea |
| Inspection Item | Wafer Chipping (Min. Chipping Size → 100 µm) |
| Dimension | W 1,250 x D 1,150 x H 1,800 (mm) |
| Weight | 700 kg |
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