Wafer Prober
Features
- Configured with a single port for loading/unloading
- Supports mixed use of 4″, 6″, and 8″ wafers
- Performs simultaneous top and bottom inspections using upper and lower optical (vision) systems
Specification
| Item | Description |
|---|---|
| Function | Wafer Probe |
| Target Device | Wafer (supports mixed use of 4″, 6″, and 8″; COK required) |
| Contact Accuracy | ± 2 µm |
| Z-Force | 150 kgf |
| Chuck Temp | Room ~ +150℃ |
| Dimension | W 1,270 x D 1,110 x H 1,700 (mm) |
| Weight | 2,000 kg |
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