Die Detach Auto Handler
영상 확인하기Features
- Die Detach MC
Specification
| Item | Description |
|---|---|
| Function | Pick & Place Die on Wafer |
| Cassette | 3 x 10 slot |
| Stage | 2 Stage |
| Die Maping Method | Camera Vision |
| Air Supply | 5~7 kg/㎠ |
| Dimension | W 2,900 x D 2,350 x H 2,000 (mm) |
| Weight | 3,500kg |
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Package
Auto Visual Inspection
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UDP
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