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Wafer Plasma

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Wafer Plasma

Wafer Plasma
Wafer Plasma
Wafer Plasma
Wafer Plasma
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Features
  • Wafer Cassette 웨이퍼 한 장을 꺼내 플라즈마 작업 후 비어있는 Wafer Cassette에 적재
Specification
ItemDescription
FunctionWafer Plasma
Target Device8’ inch (SUS ring)
Cassette288.5 x 275.8 x 70 (AL)
PowerT.B.D
Air supply5~7 kg/㎠
DimensionW 1,600 x D 1,200 x H 2,000 (mm)
Weight900Kg
Semiconductor Products