Ring Detach Auto Handler
Features
- Ring Frame 과 Wafer 분리 및 간지 삽입
Specification
| Item | Description |
|---|---|
| Function | Ring Detach Auto Handler |
| Target Device | Wafer Ring / 간지 |
| L/UL method | Manual |
| Air Supply | 5~7 kg/㎠ |
| Dimension |
W 2,000 x D 850 x H 1,700 (mm) W 2,000 x D 1,500 x H 1,700 (mm) ※ With optional features |
Semiconductor Products
PR Coater
Wafer Series
PR Striper
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DI Cleaner
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Wafer Cosmetic Inspector
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Wafer Marker & Sorter
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Wafer Sorter
Wafer Series
Wafer Prober
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Wafer Plasma
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Re Ring Auto Handler
Die Series
Ring Detach Auto Handler
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Die Tester
Die Series
SIP 실장 검사기
Package
Auto Visual Inspection
Package
UDP
Package
Package Laser Marker
Package